Judy Warner (00:00.76) Hi Stephen, thanks so much for joining us today. It's been a while and I look forward to catching up with you and talking a little bit about chiplets today. Stephen Slater (00:08.408) Yeah, it's always great to catch up with you. think the last time we met was at DesignCon, so... Judy Warner (00:12.182) Yeah, it was. And it seemed like a brief meeting too, because we were all running around like crazy. So eager to catch up. I know you're a busy guy. Well, today I wanted to talk to you about chiplets. And I know that's something you've had your hands on for a little while. And I'm sure the audience wants to learn more about kind of where we are with chiplets. So we've been talking about chiplets, it seems like for, I don't know, a few years, at least in my estimation, maybe longer. But Where are we? Can you tell us like where we are as far as adoption goes across the industry? Stephen Slater (00:49.24) Yeah, I think for us, we were very big into HBM, simulating HBM, and it was like silicon interconnects between that and another die. And that was kind of our first kind of interest area into that space. But probably about two years ago at a design con, all of a sudden, that's what everybody was talking about, was, hey, this is really going to be part of the future. And I think it was mostly, you the big players, the types of customers like, you know, Intel and AMD who were already having successful kind of designs that were making use of chiplets. That was the way that they were getting to the size and scale and yield that they required. And, you know, everyone was really interested and probably, you know, in the last year, there's been a ton of development and progress. And especially with things like the UCIE standard, so universal chiplet interconnect, that came to fruition and helped to ensure that they can build a chiplet ecosystem for the future. Judy Warner (02:04.214) Right. So who needs this technology and who sort of, why do they need it and who's adopting this technology since you've been up close to some of the UCIE standards and information? What are you seeing? Stephen Slater (02:22.87) Yeah, so I think it's important to note, you know, think about who's successful with it today. And, you know, a lot of the drivers for needing to go to a chiplet, you know, type of architecture was because the individual dyes themselves were getting so big that you ended up getting really poor yield out of a given wafer. So they decided that if they could actually, you know, break them down to small functional blocks. Therefore, you're throwing away much fewer parts of the wafer. So you get this higher yield, and yet you could still get great performance because you can put them together and make sure that they're connecting with very high -speed interconnects. And in doing so, you actually get to then get past the total radical limit of a given technology. So you can start to build these really giant processes as would be needed for things like AI engines that go into data centers. So those type of companies are very successful already. And there's certain foundries out there such as TSMC that have been putting in place a most definite series of processes to enable these chiplets to be produced, to be packaged together. yeah, there's a lot of things that need to line up in order to make this a success, but that looks to be the future. So that's part of the question, who's successful today? But your real question is who needs this? And I was really surprised actually that it really touches upon many different industries. So the types of customers who are interested, those who have joined the UCIE consortium come from all manner of aerospace defense, and then also those from automotive space as well. And what I hear is that these companies are interested in pursuing chiplets because Stephen Slater (04:34.348) it gives them better reuse inside their own company. they'd be developing chiplets that would then be reused on evolutions of products. So inside their own company. And then also them thinking about new business models to be able to sell that particular functional block that they do a really good job at that's their competitive differentiator and being able to sell that on an open, know, chiplet ecosystem market. And I think that's really exciting for everybody. So, you know, that's what Keysight would really like to hope to enable. Judy Warner (05:09.572) So when they put these chiplets together, these functional blocks that you talked about, are they put together in scale, like you said, that can be reused or are they highly customized for specific applications? Stephen Slater (05:26.476) Yeah, so the individual blocks, it can be a little bit of both, right? So I think one of the key points about it would be that as you progress to lower and lower process nodes, not every part of the IC scales down accordingly. there's, and in doing so, in trying to scale something down, then there's a lot of re -verification work that needs to happen to make sure that the circuit still works. So kind of the one of the interesting Judy Warner (05:27.096) or both. Stephen Slater (05:55.908) I say opportunities that having a chiplet kind of architecture puts out there is this concept of maybe, you know, this one functional block that's working really well at a, you know, not cutting edge technology. Maybe it's like, you know, 13 nanometer or something like that. And it works quite, it works perfectly well. We've got, you know, great confidence in its reliability. And as long as it has a standardized kind of IO, you know, interface, then we'd have the ability to put that together in the same package as another chiplet that's on the absolute latest cutting edge process node, just making sure that we spend time looking at the interconnect and making sure that the interconnects are going to work with best signal integrity. Judy Warner (06:45.11) And so sort of as an adjunct to that question, since we're talking to engineers here, right? What are you seeing as far as the enablers of the technology, which is some of what you just talked about, but what are also some of the roadblocks maybe? And maybe you can speak to sort of where we're going with those enablers and roadblocks as you see Stephen Slater (07:09.902) Yeah, for me, the enablers have to be the collaborations and in a kind of like open sharing of standards, things like this. So what I do see out there is I see some convergence in, for instance, the IOs. So it seems like UCIE is really taking off. And there's a lot of companies that are, again, part of that consortium. A lot of papers that get produced now, they're talking about UCIE. I would also like to call out companies like Alphawave that have created UCIE PHY IP that you can just take and drop into your IC. And they've actually taped it out. And they simulated with our toolset to make sure before they got there that even at the advanced packaging, the UCIE advanced high -speed interconnect, that they were able to get good signal integrity and then taped it out and verified. And so that FIIP is for sure a big enabler of this ecosystem. But it's more than that because you have to look at then to the things like the foundries and their own introduction of certain standards for how you send all your data files. Because this now is about kind of three dimensional structures and how they're going to be connected. so they've come up with their own TSMC, came up with 3D blocks specification. And there's many EDA companies that are participating to help define it and take it forward. But these are the right types of things that need to happen in order for many, many more companies to be able to play in this chiplet ecosystem. Judy Warner (08:55.938) You know, if you were looking at a scale of zero, we have no triplets to five, we can scale. Like, where are we? Would you say one to five? Stephen Slater (09:05.314) Yeah, I I still think we're in the early stages, you know, maybe maybe two along the path. That's great. Because, know, last year, I probably would have said one. But I just I'm basing that just upon the amount of interest that we see and the amount of customers that are talking to us about, you know, trying to simulate things like UCI. You know, some of the challenges, I think I missed that from your earlier question, what some of the challenges or barriers are still out Of course, when you introduce new packaging technologies like this, there's always going to be those certain technical aspects that need to be figured out. So for instance, everything's going to be connected now in a package, but what about thermal? What about vibrational mechanical stress? These are items which somehow need to be kind of co -optimized with the design or at least like the floor planning of where you're to put the individual functional blocks. So there's always going to be a trade off between things like the signal integrity. You can have perfect signal integrity by making sure that the critical nets are really, really close together and making sure you don't have excessive crosstalk. But you're going to have to be a little careful because of things like thermal considerations. And not to mention power as well. I think power is going to be very, very interesting because each of these individual chiplets needs to be powered up. But that means you have to be very careful thinking about the power distribution network as you come up through the package and then up into the individual chiplets. And I think that's going to become a bigger challenge for people to simulate and verify before they go and build. Judy Warner (10:51.768) Well, you had mentioned when you were discussing AlphaWave, the necessary piece of simulation, which of course is your wheelhouse. What does the simulation landscape look like right now? Is that something you're developing? It sounds like you're working with the UCIE consortium and how are people going to simulate? this early in the game and as they move forward. Stephen Slater (11:22.338) Yeah, absolutely. Yeah, so I think we're in a very, very, very favorable position at the moment. We came first to market with a simulation analysis flow for UCIE. So it's a signal integrity, you know, looking at how open the eyes will be under various considerations. Those eyes and how they open You need to correct settings per the standard for the transmitter and good models for the transmitter. You need models for the channel. You need models for the receiver. And not only that, there's a few special things in the standard, such as this is for compliance that they call a voltage transfer function. And another one, which is a quad data rate clocking, so it's QDR. That's something that would be needed for the really faster speeds of UCIE. you know, very thankfully we built this simulation solution. We called it Chiplet Fire Designer, but it's a part of Advanced Design System, ADS, which many of you viewers will probably be aware of. Judy Warner (12:30.348) Yeah, of course. Well, I know that I only have you for a few short moments. Talking to engineers, what would you recommend or where would you recommend they go to learn more, say about ChipletFi, but also just learn or getting involved in the consortium or just getting up to speed on chiplet technology and trying to figure out if it's a direction they should Stephen Slater (12:55.2) Yeah, absolutely. Yeah, I definitely think, you know, a lot of the big shows out there such as DAC Design Automation Conference, as well as things like the Chipplett Summits that happen and they happen in various locations. I think those are great places to be attending to try to hear the latest. I definitely know that for the UCIE consortium, they have, you know, good like working group meetings, as well as OIP is another one that is a forum You should definitely participate in if you're interested in potentially going into this as a business area arena. Finally, I would say that if what you heard today sounds kind of interesting from the simulation perspective, then we do have a webinar coming up. And this webinar is going to be actually showing the simulation solution, this chiplet PHY designer. I believe it's a couple of dates for Americas and Europe, but it's coming up later in July. Please look out for that and maybe Judy might have a link that we could post. Judy Warner (14:00.536) Yep. I'll make sure that I get that from you and your team. So thanks for that and the other recommendations as well. Steven, thank you again for giving us the short treatment on chiplets. I think it's very interesting. my last question is you, are you seeing a lot of chiplet papers pop up at say DesignCon and DAC and some of these shows? Stephen Slater (14:20.386) Yeah, definitely a marked increase. for instance, in things like, I would say a DAC, a lot of the poster sessions, talking a lot about, you know, floor planning and placement and, you know, trying to optimize, you know, for, you know, a better overall performance. And not to mention, it's probably a topic for another day, but, you know, the rise of AI, you know, inside of EDA tools I think that's another very, very interesting kind of direction that the industry is taking. Judy Warner (14:54.924) Yeah, absolutely. It seems like it's everywhere at all times and all platforms. So, well, Steven, thank you again for coming on and giving us at least a brief overview of where the industry's at with chiplets. I will definitely share the Keysight webinar and some of those other links you shared with me. Thanks again and come back soon. We'll geek out about AI and EDA tools later. That sounds like a good topic as well. Stephen Slater (14:59.086) Yes. Stephen Slater (15:20.564) Absolutely. Thanks so much Judy. I appreciate it. Thank you for watching Judy Warner (15:26.084) Thanks for everyone for joining today. I hope you enjoyed this conversation with Steven Slater of Keysight. We'll see you next week. Until then, remember to always stay connected to the ecosystem. And 15 minutes and 39 seconds. That's good. Okay. Stop. Stephen Slater (15:42.308) Perfect. Yeah, well.