EEcosystem Podcast Episodes

In this conversation, Richard Duvall and Roberto Piacentini Filho from Keysight EDA discuss the transformative impact of AI and machine learning on design engineering. They explore the implications and integration of AI-assisted tools in workflows, the implications for 5G and 6G design, the importance of AI infrastructure, and the power integrity challenges in data centers. Keysight EDA 2025 launch event is on December 3, 2024, and will feature a closer look into the subjects discussed in this podcast. See the link below to learn more and register.

In this conversation, Breadboard CEO Zachary Feuerstein discusses the innovative AI-enabled supply chain platform designed to streamline the procurement process for engineers and manufacturers. He highlights the challenges faced in the electronic supply chain and the solutions offered by integrating AI and LLMs to structure data, creating unique features that set Breadboard apart from competitors. The discussion also addresses industry skepticism regarding automation in engineering and presents quantifiable time and cost savings achieved through the platform.

Valentina Ratner, co-founder of AllSpice.io, talks about their game-changing platform for hardware engineers. She discusses how it streamlines design reviews, version control, and team collaboration, all powered by AI. Valentina explains how their "GitHub for hardware" tool boosts productivity, reduces errors, and allows engineers to focus on innovation. Perfect for teams ready to modernize their workflow using their existing tech stack.

This week on The EEcosystem, David Lane brings 30 years of design engineering and PCB assembly expertise to the table. He dives into the critical differences between prototypes and NPI, sharing tips to get it right early in development. Plus, discover how to harness the power of both human and AI capabilities when selecting your assembly partner. Don’t miss this blend of experience and innovation!

In this conversation, Judy Warner and Alex Ippich of Isola discuss the evolving landscape of high-speed digital (HSD) and RF engineering, emphasizing the importance of proactive communication and collaboration early in the design. They explore the challenges posed by the convergence of these fields, the role of digital tools in facilitating collaboration, and innovations in laminate materials that enhance design flexibility.

Ken Wyatt discusses EMC tips and tricks he’s developed over decades to help engineers diagnose and troubleshoot EMC issues right from their workbench. He’s published his knowledge in a popular book trilogy we talk about in this episode.

Most factors that affect Signal Integrity are well-understood by many professional engineers. However, a whole new paradigm shift has emerged over the last twenty years as SI has moved ICs. SI Expert, Donald Telian has helped hundreds of engineers and companies working on thousands of designs around the globe to learn how to solve signal integrity in this new era of SI. Now, Telian is partnering with The EEcosystem to share this knowledge in a series of Masterclass LIVE workshops that are available to the public for the first time. In this episode, Telian explains what attendees can expect to learn and why learning in person with an experienced mentor is so critical for engineers to master these techniques and principles that can be applied immediately.

In this episode, Dr. Eric Bogatin talks about his upcoming activities at DesignCon 2024. He discusses the demonstration he’ll make in the Chiphead Theater, measuring the bandwidth of scope probes. For the first time, his students from CU Boulder High-Speed Digital Engineering Group will have a booth and focus on how low-cost tools and solutions can be used for professional engineers while showing the importance of practical engineering judgment regardless of the tools used. Also discussed is how engineers can find high-quality curated technical content and how to continually learn and grow–one of which is Signal Integrity Journal where Eric is the Technical Editor.