Growing RF Interconnect Design Challenges And Solutions

Guests Jim Alexander, Pete Robertson | Uploaded : 12/12/2023

The EEcosystem Podcast

Growing RF Interconnect Design Challenges And Solutions

Increasing frequencies and shrinking footprints that continue to emerge between RF connectors and PCBs require awareness around new design considerations and available solutions. In this conversation with Jim Alexander and Pete Robertson of Samtec, they offer critical insight and expertise relative to this subject matter. Samtec has shared a free downloadable white paper for The EEcosystem Community at https://theecosystem.com


Wideband Launches: More than Footprints on PCBs White paper

Samtec brochure: Magnum RF


Samtec RF Catalog



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